• - Samsung unveils new uMCP package, consisting of LPDDR5 RAM and UFS 3.1 internal storage

    Samsung unveils new uMCP package, consisting of LPDDR5 RAM and UFS 3.1 internal storage

    5 Days, 22 Hours ago

    Tags:    -  UFS  -  Samsung

    On Tuesday, June 15, 2021, Samsung unveiled its latest memory solution for use in smartphones. In this product - called LPDDR5 uMCP - DRAM (LPDDR5) memory is integrated with the internal NAND flash memory (UFS 3.1) on a single chip (so-called "closed" memory chip) Or "package"). Not bad to know, this is the first package that combines LPDDR5 RAM with UFS 3.1 internal memory. According to the manufacturer, the new LPDDR5 uMCP chip has entered the mass production phase and can bring flagship-level performance to handsets with chipsets.  <b>Samsung</b> <b>unveils</b> <b>new</b> <b>uMCP</b> package <b>consisting</b> of <b>LPDDR5</b> <b>RAM</b> and <b>UFS</b> <b>3.1</b> <b>internal</b> memory

    Samsung, the new LPDDR5 uMCP chip, is built on Samsung's rich advanced memory capabilities as well as the company's high ability to build packages, and can provide uninterrupted streaming, gaming, and uninterrupted augmented reality experience - even for lower-end devices. . He went on to say that 5G devices are becoming more ubiquitous, and expressed hope that this multi-chip package could accelerate the transition to 5G.

    According to Samsung, the new uMCP chip can provide high speed and a lot of storage space with a lot of consumption. Offer down. Combining LPDDR5 RAM with UFS 3.1 internal storage in this package paves the way for taking advantage of many 5G functions - previously only available on flagship models. These include advanced photography, high-graphics games, and augmented reality. According to the manufacturer, compared to the previous package (which consisted of LPDDR4X RAM and UFS 2.2 internal memory), in this new package, DRAM performance has increased by 50%, from 17 GB/s to 25 GB/s. NAND flash memory performance has also doubled, from 1.5 GB/s to 3 GB/s. <b>Samsung</b> <b>unveils</b> <b>new</b> <b>uMCP</b> <b>package,</b> <b>consisting</b> of <b>LPDDR5</b> <b>RAM</b> and <b>UFS</b> <b>3.1</b> <b>internal</b> storage

    Samsung's new uMCP package measures 11.5 x 13 mm, so with its small size it can open up space for more features in the smartphone. It should be noted that this package is made in different configurations. Package RAM capacity ranges from 6 to 12 GB and internal memory capacity varies from 128 to 512 GB to meet the needs of a wide range of intermediate to advanced devices. Samsung claims to have successfully passed the LPDDR5 uMCP compatibility tests with several major smartphone makers, and devices with the package are expected to hit the market soon this month.

    Labels: samsung, unveils, new, umcp, package,, consisting, lpddr5, ram, ufs, 3.1, internal, storage

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